Space Electronics Packaging and Mechanical Product Design and Analysis Engineer (Associate or Mid-level)

Space Electronics Packaging and Mechanical Product Design and Analysis Engineer (Associate or Mid-level) Company: The Boeing Company Boeing Defense, Space and Security (BDS), Space, Intelligence & Weapons Systems (SI&WS) division is currently hiring an Associate or Mid-Level Space Electronics Packaging and Mechanical Product Design and Analysis Engineer (Level 2 or 3) to join us as part of our Electronics Packaging and Mechanical Product Design Team located in El Segundo, California. We are seeking exceptional Mechanical Engineers with a passion for innovation to join our team and become part of something truly remarkable. As a Space Electronics Packaging Design and Analysis Engineer, you will play a pivotal role in shaping the future of space exploration with us. We offer an unparalleled opportunity to be part of a team that conducts full in-house cradle-to-grave work, providing you with a unique and fulfilling experience. From the moment you step through our doors, you will have the chance to contribute to every stage of the product lifecycle, from initial design concepts to prototyping and final production. This includes mechanical PCB design, Electronics Packaging, and Thermal/Structural/Vibration Analysis. You will be at the forefront of satellite missions, unlocking new frontiers in space exploration. In addition, you will have the opportunity to work on projects involving multichip modules, microelectronics, electronic systems, and much more. The breadth of our work while working alongside world-class engineers and mentors, will inspire and guide you and challenge you to expand your skillset and delve into fascinating new areas, making every day a thrilling adventure. To further enhance your experience, our on-site satellite factory is at your disposal, enabling you to unleash your creativity and expertise while delivering solutions at the highest level of excellence. This proximity allows for seamless collaboration with satellite engineers, giving you firsthand knowledge of the intricacies and complexities of satellite missions. By working closely with experts in the field, you will contribute to the seamless integration of our electronics packaging solutions, ensuring they meet the rigorous demands of the space environment. Develop your technical competence as well as your leadership skills at a company with huge potential for long-term career growth. We’re highly supportive of innovative thinking, we respect and acknowledge hard work, we recognize maturity and integrity, and we reward bottom-line achievement. #TheFutureIsBuiltHere Position Responsibilities: • Coordinate with multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements • Guides structural design and configuration development by performing trade studies to optimize structure and meet program requirements • Performs detailed structural and thermal analysis using hand calculations and analysis tools • Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level • Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs) • Validates designs through various methods of review, testing and analysis • Develops, deploys and supports new processes and process improvement to enable efficient performance of engineering tasks to reduce cycle time and drive product improvements • Conducts Root Cause and Corrective Action to investigate failures and go-forward plans • Identifies, tracks and statuses technical performance measures to measure progress and ensure compliance with requirements • Supports Supplier Management with make/buy recommendations and other technical services of limited scope • Investigates emerging technologies to develop concepts for future product designs to meet projected requirements • Works under general direction This position is expected to be 100% onsite. The selected candidate will be required to work onsite in El Segundo, CA. Basic Qualifications (Required Skills/Experience): • This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship as a condition of employment. A final U.S. Top Secret/SCI Clearance Post-Start is required • Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement • 2+ years of experience using Computer-Aided Design (CAD) tools • Experience in electronic packaging -OR- printed circuit board design and assembly (PCB/PCBA) -OR- thermal, structural, dynamics, and/or vibration analysis and tools Preferred Qualifications (Desired Skills/Experience): • Mid-Level (Level 3): 5+ years of related work experience or an equivalent combination of technical education and experience • Active U.S. Top Secret /SCI Security Clearance • Experience within aerospace or related industry or with space electronics • Experience with ANSYS analysis, Creo CAD, SolidWorks, Finite Element Analysis (FEA), Siemens NX Nastran, MSC Patran, COMSOL Multiphysics • Excellent oral and written communication skills and ability to communicate across multiple disciplines with internal and external customers • Skill and ability to collect, organize, synthesize, and analyze data; summarize findings; develop conclusions and recommendations from appropriate data sources • Experience leading teams on complex projects Conflict of Interest: Successful candidates for this job must satisfy the Company's Conflict of Interest (COI) assessment process. Drug Free Workplace: Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines,