Senior Thin Films Metals Deposition Engineer

Job Details: Job Description: About the Group Manufacturing Development Customer Engineering (MDCE) is a new organization within Intel Foundry Technology Manufacturing focused on improving process capability for Intel's technology nodes from initial product qualification to high volume manufacturing with the vision of making technology ramp a competitive advantage for Intel foundry. This team is responsible for transferring new technologies into high-volume manufacturing, driving process optimization and continuous improvement, resolving complex yield and manufacturing issues, partnering closely with technology development and factory teams to ensure robust, predictable silicon delivery. About the Role MDCE Metals Deposition Engineer is responsible for enabling best-in-class process performance and manufacturability for advanced metals deposition modules across Intel 18A, Intel 3, and Intel 12nm technology nodes. This role sits at the intersection of Technology Development (TD), High Volume Manufacturing (HVM), and Customer Engineering, driving module readiness from early development through full HVM ramp and sustaining. The Ideal Candidate Will Possess • Leadership and Trust: Strong leadership, resourcefulness, and the ability to manage extremely sensitive information. • Competency, Performance: A high performer with a track record of significant accomplishments. • Experience Expertise: Cross-functional team leadership is a plus, significant expertise spanning multiple technology nodes and modules driving improvement to yield, performance, variation. • Technical and Business Acumen: A combination of technical capability, business acumen, and executive expertise to drive results across multiple groups and disciplines. • Communication Skills: Excellent written and verbal communication skills, with the ability to interpret and present technical information clearly to various audiences. • Initiative and Perseverance: Strong self-initiative, persistence, and the ability to navigate ambiguity and drive clarity in key areas. • Detail Orientation: Ability to gather, analyze, and interpret data to drive results. • Pressure Handling: Willingness to handle high degrees of task and deadline pressure in a dynamic environment while remaining focused. • Industry Knowledge: Deep knowledge of technology development and manufacturing strategies, products, processes, fab structure, and transfer methodology. Demonstrated ability to understand and interpret industry trends, create and drive strategies, work independently, simultaneously manage diverse and extensive assignments while remaining organized and productive. • Cultural Change: Demonstrated results in driving organizational culture change through workplace of choice efforts. Job Responsibilities Include but Are Not Limited To: • Strategic Alignment and Customer-first Execution: Align organizational goals with technical vision, formulate technical strategies to deliver cutting-edge solutions, and demonstrate relentless execution to meet customer needs on time. • Synthesis of Diverse Information: Ability to gather diverse inputs, uplevel to the right strategic response. • Problem Solving: Own the resolution of technical challenges and integrate solutions across multiple groups (including technology development and high volume manufacturing) Demonstrated ability to perform data driven root cause analysis using structured problem-solving methods and common data/analytics tools. • Collaboration: Work closely with direct and extended technology development (TD) and manufacturing (TFSM) members and Business Groups to achieve common goals. • Stakeholder Engagement: Engage and interface with internal and external stakeholders, including Integration, Device, Yield, Defect Metrology, Quality and Reliability, and suppliers. Establish strong working relationships. • Industry Trends: Stay updated on relevant industry direction setting technologies. • Rapid Execution: Conceptualize strategies and put them into motion swiftly to meet challenging schedules. • Team Management: Define goals for the team, remove roadblocks, and facilitate timely delivery of process solutions. Own the outcome, surface and resolve issues quickly. • Work Together, in Person: Work together with team members in person to enable faster decision making and problem resolution Qualifications: The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications • Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related engineering/science field. • 6+ years of relevant experience in semiconductor manufacturing, process development, or technology development. • 4+ years direct experience in metals deposition modules. • Hands-on experience with thin film deposition technologies in at least one of the following areas: Frontend or middle-of-line, Backend metals / interconnect or other critical conductive or barrier/liner films supporting logic technologies. • 3+ years of experience with one or more deposition technologies: PVD, CVD, and/or ALD for metals, conductive films, or barrier/liner stacks. • Experience with integration and module interactions (e.g., Deposition with CMP, lithography, etch, clean) and impact of deposition on device performance and yield. Preferred Qualifications: • Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related engineering/science field. • Experience in advanced technology nodes (e.g., 10nm class and below), ideally with exposure to Intel 18A, Intel 3, Intel 4/7, or comparable