Staff Chemical Mechanical Planarization (CMP) Engineer

Job Details: Job Description: Shape the Future of Semiconductor Innovation at Intel Foundry Organization Overview Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry Technology Manufacturing and is focused on accelerating technology ramp and manufacturing excellence. Our mission is to seamlessly transition cutting-edge technologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry. Position Summary MDCE is seeking a Staff Chemical Mechanical Planarization (CMP) Engineer to drive module ownership and technical leadership across Intel's most advanced logic technologies (18A, Intel 3, Intel 12nm). This role requires a seasoned professional who can navigate the complexities of process development, cross-node standardization, and high-volume manufacturing readiness while delivering exceptional results for both Intel products and foundry customers. Core Responsibilities Technical Leadership • Process Development & Optimization: Lead CMP process development from concept through HVM implementation across multiple advanced technology nodes • Cross-Node Alignment: Drive standardization and best practices across Intel's technology portfolio to maximize efficiency and yield • Problem Resolution: Own and resolve complex CMP-related yield and manufacturing issues using data-driven approaches and structured problem-solving methodologies Strategic Execution • Customer-Centric Delivery: Align technical strategies with customer requirements and business objectives, ensuring on-time delivery of robust solutions • Technology Transfer: Bridge technology development and manufacturing teams to ensure smooth transition of CMP processes to production • Continuous Improvement: Drive ongoing optimization initiatives to enhance process capability, yield, and manufacturing efficiency Collaboration & Leadership • Cross-Functional Partnership: Work closely with Integration, Device, Yield, Factory, Quality, and Customer Engineering teams • Supplier Engagement: Collaborate with equipment and consumables suppliers to co-develop and optimize CMP solutions • Team Development: Mentor junior engineers and provide technical guidance across the organization Professional Excellence • Proven Track Record: History of significant technical accomplishments and successful project delivery • Leadership Capability: Ability to influence and drive results across multiple organizations and disciplines • Business Acumen: Understanding of semiconductor industry trends, manufacturing strategies, and customer requirements Personal Attributes • Communication Skills: Exceptional ability to communicate complex technical concepts to diverse audiences • Adaptability: Thrives in ambiguous situations and can drive clarity in complex technical challenges while work effectively in fast-paced, high-pressure environments • Initiative: Self-motivated with strong persistence and ability to work independently • Quality Focus: Meticulous attention to detail with commitment to safety, quality, and compliance standards Qualifications: The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications • Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field • 5+ years of experience in semiconductor manufacturing / process development or technology development • 3+ years of direct experience in Chemical Mechanical Planarization (CMP) process development experience with hands-on process tuning and characterization • Experience with major CMP equipment platforms in one of the following platforms (AMAT, Ebara, etc.) • Experience with CMP consumables (e.g. slurries, pads, conditioning disks, filters, clean chemistries) • Previous semiconductor foundry experience Preferred Qualifications • Doctorate in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field • Experience with advanced technology nodes (e.g. sub-10nm logic, specifically in Gate All Around (GAA) architectures with track record of successful technology development and HVM implementation • Cross-functional leadership experience, including task force leadership for yield improvement initiatives • Experience with CMP integration with other process modules (e.g. deposition, lithography, etch, clean) and CMP-relevant metrology with understanding of CMP impact on device performance and yield. • Experience with CMP-relevant metrology and process control (e.g. thickness, topography, defects, roughness, particles) Work Environment This role requires in-person collaboration to enable rapid decision-making and effective problem resolution. You'll work in a dynamic, fast-paced environment with competing priorities while maintaining the highest standards for safety, quality, and customer satisfaction. Impact & Growth Join a team that's reshaping Intel's foundry capabilities and directly influencing the success of next-generation semiconductor technologies. This role offers exceptional opportunities for professional growth, technical leadership, and meaningful impact on Intel's strategic objectives in the foundry market. Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: US, Arizona, Phoenix Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physica